C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu. Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectronics Reliability, 47(2-3):266-272, 2007. [doi]
@article{AnderssonATL07,
title = {Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints},
author = {C. Andersson and D. R. Andersson and P. E. Tegehall and Johan Liu},
year = {2007},
doi = {10.1016/j.microrel.2006.09.014},
url = {http://dx.doi.org/10.1016/j.microrel.2006.09.014},
tags = {C++, e-science},
researchr = {https://researchr.org/publication/AnderssonATL07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {2-3},
pages = {266-272},
}