François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, D. Lattard, Sebastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet. A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. In 2018 International Conference on IC Design & Technology, ICICDT 2018, Otranto, Italy, June 4-6, 2018. pages 141-144, IEEE, 2018. [doi]
@inproceedings{AndrieuBBFLTBFV18,
title = {A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit},
author = {François Andrieu and Perrine Batude and Laurent Brunet and Claire Fenouillet-Béranger and D. Lattard and Sebastien Thuries and Olivier Billoint and R. Fournel and Maud Vinet},
year = {2018},
doi = {10.1109/ICICDT.2018.8399776},
url = {https://doi.org/10.1109/ICICDT.2018.8399776},
researchr = {https://researchr.org/publication/AndrieuBBFLTBFV18},
cites = {0},
citedby = {0},
pages = {141-144},
booktitle = {2018 International Conference on IC Design & Technology, ICICDT 2018, Otranto, Italy, June 4-6, 2018},
publisher = {IEEE},
isbn = {978-1-5386-2550-7},
}