A system-level solution for managing spatial temperature gradients in thinned 3D ICs

Arunachalam Annamalai, Raghavan Kumar, Arunkumar Vijayakumar, Sandip Kundu. A system-level solution for managing spatial temperature gradients in thinned 3D ICs. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 88-95, IEEE, 2013. [doi]

@inproceedings{AnnamalaiKVK13,
  title = {A system-level solution for managing spatial temperature gradients in thinned 3D ICs},
  author = {Arunachalam Annamalai and Raghavan Kumar and Arunkumar Vijayakumar and Sandip Kundu},
  year = {2013},
  doi = {10.1109/ISQED.2013.6523595},
  url = {http://dx.doi.org/10.1109/ISQED.2013.6523595},
  researchr = {https://researchr.org/publication/AnnamalaiKVK13},
  cites = {0},
  citedby = {0},
  pages = {88-95},
  booktitle = {International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013},
  publisher = {IEEE},
  isbn = {978-1-4673-4951-2},
}