Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package

Ricky Anthony, Santosh Kulkarni, Ningning Wang, Seán Cian O. Mathuna. Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]

@inproceedings{AnthonyKWM14,
  title = {Advanced processing for high efficiency inductors for 2.5D/3D Power Supply in Package},
  author = {Ricky Anthony and Santosh Kulkarni and Ningning Wang and Seán Cian O. Mathuna},
  year = {2014},
  doi = {10.1109/3DIC.2014.7152183},
  url = {http://dx.doi.org/10.1109/3DIC.2014.7152183},
  researchr = {https://researchr.org/publication/AnthonyKWM14},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
  publisher = {IEEE},
  isbn = {978-1-4799-8472-5},
}