Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda. Void reduction in wafer bonding by simultaneously formed ventilation channels. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
Abstract is missing.