Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson. A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59:126-133, 2016. [doi]
@article{ArjmandACLMJ16,
title = {A thermal cycling reliability study of ultrasonically bonded copper wires},
author = {Elaheh Arjmand and Pearl A. Agyakwa and Martin R. Corfield and Jianfeng Li and Bassem Mouawad and C. Mark Johnson},
year = {2016},
doi = {10.1016/j.microrel.2016.01.009},
url = {http://dx.doi.org/10.1016/j.microrel.2016.01.009},
researchr = {https://researchr.org/publication/ArjmandACLMJ16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {59},
pages = {126-133},
}