BIST architecture to detect defects in tsvs during pre-bond testing

Daniel Arumí, Rosa Rodríguez-Montañés, Joan Figueras. BIST architecture to detect defects in tsvs during pre-bond testing. In 18th IEEE European Test Symposium, ETS 2013, Avignon, France, May 27-30, 2013. pages 1, IEEE Computer Society, 2013. [doi]

@inproceedings{ArumiRF13,
  title = {BIST architecture to detect defects in tsvs during pre-bond testing},
  author = {Daniel Arumí and Rosa Rodríguez-Montañés and Joan Figueras},
  year = {2013},
  doi = {10.1109/ETS.2013.6569389},
  url = {http://doi.ieeecomputersociety.org/10.1109/ETS.2013.6569389},
  researchr = {https://researchr.org/publication/ArumiRF13},
  cites = {0},
  citedby = {0},
  pages = {1},
  booktitle = {18th IEEE European Test Symposium, ETS 2013, Avignon, France, May 27-30, 2013},
  publisher = {IEEE Computer Society},
  isbn = {978-1-4673-6376-1},
}