Pre-bond testing of weak defects in TSVs

Daniel Arumí, Rosa Rodríguez-Montañés, Joan Figueras. Pre-bond testing of weak defects in TSVs. In 2014 IEEE 20th International On-Line Testing Symposium, IOLTS 2014, Platja d'Aro, Girona, Spain, July 7-9, 2014. pages 31-36, IEEE, 2014. [doi]

@inproceedings{ArumiRF14,
  title = {Pre-bond testing of weak defects in TSVs},
  author = {Daniel Arumí and Rosa Rodríguez-Montañés and Joan Figueras},
  year = {2014},
  doi = {10.1109/IOLTS.2014.6873668},
  url = {http://dx.doi.org/10.1109/IOLTS.2014.6873668},
  researchr = {https://researchr.org/publication/ArumiRF14},
  cites = {0},
  citedby = {0},
  pages = {31-36},
  booktitle = {2014 IEEE 20th International On-Line Testing Symposium, IOLTS 2014, Platja d'Aro, Girona, Spain, July 7-9, 2014},
  publisher = {IEEE},
}