Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations

A. Aubert, L. Dantas de Morais, J. P. Rebrasse. Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. Microelectronics Reliability, 48(8-9):1144-1148, 2008. [doi]

Abstract

Abstract is missing.