Jürgen Auersperg, Ellen Auerswald, C. Collet, Th. Dean, Dietmar Vogel, Th. Winkler, Sven Rzepka. Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectronics Reliability, 87:238-244, 2018. [doi]
Abstract is missing.