On the crack and delamination risk optimization of a Si-interposer for LED packaging

J. Auersperg, R. Dudek, R. Jordan, O. Bochow-Neß, S. Rzepka, B. Michel. On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectronics Reliability, 54(6-7):1223-1227, 2014. [doi]

Abstract

Abstract is missing.