Md. Sadik Awal, Md Tauhidur Rahman. Disassembling Software Instruction Types through Impedance Side-channel Analysis. In IEEE International Symposium on Hardware Oriented Security and Trust, HOST 2023, San Jose, CA, USA, May 1-4, 2023. pages 227-237, IEEE, 2023. [doi]
@inproceedings{AwalR23,
title = {Disassembling Software Instruction Types through Impedance Side-channel Analysis},
author = {Md. Sadik Awal and Md Tauhidur Rahman},
year = {2023},
doi = {10.1109/HOST55118.2023.10133318},
url = {https://doi.org/10.1109/HOST55118.2023.10133318},
researchr = {https://researchr.org/publication/AwalR23},
cites = {0},
citedby = {0},
pages = {227-237},
booktitle = {IEEE International Symposium on Hardware Oriented Security and Trust, HOST 2023, San Jose, CA, USA, May 1-4, 2023},
publisher = {IEEE},
isbn = {979-8-3503-0062-8},
}