Disassembling Software Instruction Types through Impedance Side-channel Analysis

Md. Sadik Awal, Md Tauhidur Rahman. Disassembling Software Instruction Types through Impedance Side-channel Analysis. In IEEE International Symposium on Hardware Oriented Security and Trust, HOST 2023, San Jose, CA, USA, May 1-4, 2023. pages 227-237, IEEE, 2023. [doi]

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