Through Silicon Via-Based Grid for Thermal Control in 3D Chips

José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici. Through Silicon Via-Based Grid for Thermal Control in 3D Chips. In Alexandre Schmid, Sanjay Goel, Wei Wang, Valeriu Beiu, Sandro Carrara, editors, Nano-Net - 4th International ICST Conference, Nano-Net 2009, Lucerne, Switzerland, October 18-20, 2009. Proceedings. Volume 20 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, pages 90-98, Springer, 2009. [doi]

Abstract

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