High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging - researchr publication authors

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Farrokh Ayazi, Haoran Wen, Yaesuk Jeong, Pranav Gupta, Anosh Daruwalla, Chang-Shun Liu. High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging. In IEEE Custom Integrated Circuits Conference, CICC 2019, Austin, TX, USA, April 14-17, 2019. pages 1-8, IEEE, 2019. [doi]

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