Farrokh Ayazi, Haoran Wen, Yaesuk Jeong, Pranav Gupta, Anosh Daruwalla, Chang-Shun Liu. High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging. In IEEE Custom Integrated Circuits Conference, CICC 2019, Austin, TX, USA, April 14-17, 2019. pages 1-8, IEEE, 2019. [doi]
@inproceedings{AyaziWJGDL19,
title = {High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging},
author = {Farrokh Ayazi and Haoran Wen and Yaesuk Jeong and Pranav Gupta and Anosh Daruwalla and Chang-Shun Liu},
year = {2019},
doi = {10.1109/CICC.2019.8780183},
url = {https://doi.org/10.1109/CICC.2019.8780183},
researchr = {https://researchr.org/publication/AyaziWJGDL19},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {IEEE Custom Integrated Circuits Conference, CICC 2019, Austin, TX, USA, April 14-17, 2019},
publisher = {IEEE},
isbn = {978-1-5386-9395-7},
}