Josip Bacmaga, Raul Blecic, Renaud Gillon, Adrijan Baric. 3D EM simulations and analysis of in-package metal plate interconnecting high-side and low-side FETs of DC-DC converter. In 2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015, Cairo, Egypt, December 6-9, 2015. pages 364-367, IEEE, 2015. [doi]
Abstract is missing.