Aref Bakhtazad, Rayyan Manwar, Sazzadur Chowdhury. Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB). In IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014, Santiago, Chile, February 25-28, 2014. pages 1-4, IEEE, 2014. [doi]
Abstract is missing.