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Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability

M. Balmont, Isabelle Bord-Majek, B. Poupard, Laurent Béchou, Yves Ousten. Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectronics Reliability, 88:1108-1112, 2018. [doi]

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