High Performance Packaged Electronics for the IBM ES9000:::TM::: Mainframe

Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur, Rao R. Tummala. High Performance Packaged Electronics for the IBM ES9000:::TM::: Mainframe. In Proceedings 1991 IEEE International Conference on Computer Design: VLSI in Computer & Processors, ICCD 91, Cambridge, MA, USA, October 14-16, 1991. pages 534-539, IEEE Computer Society, 1991.

@inproceedings{BarishEMSGT91,
  title = {High Performance Packaged Electronics for the IBM ES9000:::TM::: Mainframe},
  author = {Arnold E. Barish and James P. Eckhardt and Mark D. Mayo and Walter A. Svarczkopf and Santosh P. Gaur and Rao R. Tummala},
  year = {1991},
  researchr = {https://researchr.org/publication/BarishEMSGT91},
  cites = {0},
  citedby = {0},
  pages = {534-539},
  booktitle = {Proceedings 1991 IEEE International Conference on Computer Design: VLSI in Computer & Processors, ICCD  91, Cambridge, MA, USA, October 14-16, 1991},
  publisher = {IEEE Computer Society},
  isbn = {0-8186-2270-9},
}