High Performance Packaged Electronics for the IBM ES9000:::TM::: Mainframe

Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur, Rao R. Tummala. High Performance Packaged Electronics for the IBM ES9000:::TM::: Mainframe. In Proceedings 1991 IEEE International Conference on Computer Design: VLSI in Computer & Processors, ICCD 91, Cambridge, MA, USA, October 14-16, 1991. pages 534-539, IEEE Computer Society, 1991.

Abstract

Abstract is missing.