Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen. Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectronics Reliability, 52(9-10):2278-2282, 2012. [doi]

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