Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen. Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectronics Reliability, 52(9-10):2278-2282, 2012. [doi]

Abstract

Abstract is missing.