Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier. Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, CA, USA, March 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
Abstract is missing.