Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown - researchr publication

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Muhammad Bashir, Linda S. Milor, Dae-Hyun Kim, Sung Kyu Lim. Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown. Microelectronics Reliability, 50(9-11):1341-1346, 2010. [doi]

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