Markus Bauer, Benjamin Uhrich, Martin Schäfer, Oliver Theile, Christoph Augenstein, Erhard Rahm. Multi-Modal Artificial Intelligence in Additive Manufacturing: Combining Thermal and Camera Images for 3D-Print Quality Monitoring. In Joaquim Filipe, Michal Smialek, Alexander Brodsky 0001, Slimane Hammoudi, editors, Proceedings of the 25th International Conference on Enterprise Information Systems, ICEIS 2023, Volume 1, Prague, Czech Republic, April 24-26, 2023. pages 539-546, SCITEPRESS, 2023. [doi]
Abstract is missing.