Maciej Bednarek, Guillermo Barrenetxea, Mirja Kühlewind, Brian Trammell. Multipath bonding at Layer 3. In Lars Eggert, Colin Perkins, editors, Proceedings of the 2016 Applied Networking Research Workshop, ANRW 2016, Berlin, Germany, July 16, 2016. pages 7-12, ACM, 2016. [doi]
Abstract is missing.