Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards

Csaba Benedek, Olivér Krammer, Mihály Janoczki, László Jakab. Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards. IEEE Transactions on Industrial Electronics, 60(6):2318-2331, 2013. [doi]

Abstract

Abstract is missing.