Gennadi Bersuker. Assessing device reliability through atomic-level modeling of material characteristics. In 2014 IEEE International Conference on IC Design & Technology, ICICDT 2014, Austin, TX, USA, May 28-30, 2014. pages 1-3, IEEE, 2014. [doi]
@inproceedings{Bersuker14,
title = {Assessing device reliability through atomic-level modeling of material characteristics},
author = {Gennadi Bersuker},
year = {2014},
doi = {10.1109/ICICDT.2014.6838622},
url = {http://dx.doi.org/10.1109/ICICDT.2014.6838622},
researchr = {https://researchr.org/publication/Bersuker14},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {2014 IEEE International Conference on IC Design & Technology, ICICDT 2014, Austin, TX, USA, May 28-30, 2014},
publisher = {IEEE},
isbn = {978-1-4799-2153-9},
}