Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel. Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectronics Reliability, 49(9-11):1267-1272, 2009. [doi]

Abstract

Abstract is missing.