Three-dimensional finite-element thermal simulation of GaN-based HEMTs

F. Bertoluzza, Nicola Delmonte, Roberto Menozzi. Three-dimensional finite-element thermal simulation of GaN-based HEMTs. Microelectronics Reliability, 49(5):468-473, 2009. [doi]

Authors

F. Bertoluzza

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Nicola Delmonte

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Roberto Menozzi

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