Three-dimensional finite-element thermal simulation of GaN-based HEMTs

F. Bertoluzza, Nicola Delmonte, Roberto Menozzi. Three-dimensional finite-element thermal simulation of GaN-based HEMTs. Microelectronics Reliability, 49(5):468-473, 2009. [doi]

@article{BertoluzzaDM09,
  title = {Three-dimensional finite-element thermal simulation of GaN-based HEMTs},
  author = {F. Bertoluzza and Nicola Delmonte and Roberto Menozzi},
  year = {2009},
  doi = {10.1016/j.microrel.2009.02.009},
  url = {http://dx.doi.org/10.1016/j.microrel.2009.02.009},
  tags = {rule-based},
  researchr = {https://researchr.org/publication/BertoluzzaDM09},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {49},
  number = {5},
  pages = {468-473},
}