Anshuman Bhuyan, Jung Woo Choe, Byung-chul Lee, Ira O. Wygant, Amin Nikoozadeh, Ömer Oralkan, Butrus T. Khuri-Yakub. 3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology. In 2013 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2013, San Francisco, CA, USA, February 17-21, 2013. pages 396-397, IEEE, 2013. [doi]
Abstract is missing.