Fabian Boeser, Juan S. Ordonez, Martin Schuettler, Thomas Stieglitz, Dennis T. T. Plachta. Non-hermetic encapsulation for implantable electronic devices based on epoxy. In 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2015, Milan, Italy, August 25-29, 2015. pages 809-812, IEEE, 2015. [doi]
Abstract is missing.