Detlef Bonfert, Horst A. Gieser, Heinrich Wolf, M. Frank, A. Konrad, J. Schulz. Transient-induced latch-up test setup for wafer-level and package-level. Microelectronics Reliability, 46(9-11):1629-1633, 2006. [doi]
@article{BonfertGWFKS06,
title = {Transient-induced latch-up test setup for wafer-level and package-level},
author = {Detlef Bonfert and Horst A. Gieser and Heinrich Wolf and M. Frank and A. Konrad and J. Schulz},
year = {2006},
doi = {10.1016/j.microrel.2006.08.002},
url = {http://dx.doi.org/10.1016/j.microrel.2006.08.002},
tags = {testing},
researchr = {https://researchr.org/publication/BonfertGWFKS06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {9-11},
pages = {1629-1633},
}