V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, A. Vest. Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectronics Reliability, 49(1):74-78, 2009. [doi]
No references recorded for this publication.
No citations of this publication recorded.