Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity

V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, A. Vest. Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectronics Reliability, 49(1):74-78, 2009. [doi]

Abstract

Abstract is missing.