Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer 0002, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang. From fan-out wafer to fan-out panel level packaging. In European Conference on Circuit Theory and Design, ECCTD 2015, Trondheim, Norway, August 24-26, 2015. pages 1-4, IEEE, 2015. [doi]
Abstract is missing.