Advances in Qucs-S Schematic Capture for SPICE and Verilog-A Device Modelling and Circuit Simulation

Mike Brinson, Daniel Tomaszewski. Advances in Qucs-S Schematic Capture for SPICE and Verilog-A Device Modelling and Circuit Simulation. In 29th International Conference on Mixed Design of Integrated Circuits and System, MIXDES 2022, Wrocław, Poland, June 23-24, 2022. pages 27-32, IEEE, 2022. [doi]

Abstract

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