Impact of Material Interface Geometry on Interconnect Resistance

Lee Brogan, Jon Reid. Impact of Material Interface Geometry on Interconnect Resistance. In IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022. pages 425-426, IEEE, 2022. [doi]

Authors

Lee Brogan

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Jon Reid

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