Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs - researchr publication authors

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Lars Brusberg, Aramais R. Zakharian, S. Ekin Kocabas, Jason R. Grenier, Chad C. Terwilliger, Alan F. Evans. Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs. In Optical Fiber Communications Conference and Exhibition, OFC 2020, San Diego, CA, USA, March 8-12, 2020. pages 1-3, IEEE, 2020. [doi]

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