Lars Brusberg, Aramais R. Zakharian, S. Ekin Kocabas, Jason R. Grenier, Chad C. Terwilliger, Alan F. Evans. Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs. In Optical Fiber Communications Conference and Exhibition, OFC 2020, San Diego, CA, USA, March 8-12, 2020. pages 1-3, IEEE, 2020. [doi]
@inproceedings{BrusbergZKGTE30,
title = {Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs},
author = {Lars Brusberg and Aramais R. Zakharian and S. Ekin Kocabas and Jason R. Grenier and Chad C. Terwilliger and Alan F. Evans},
year = {2020},
url = {https://ieeexplore.ieee.org/document/9083179},
researchr = {https://researchr.org/publication/BrusbergZKGTE30},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2020, San Diego, CA, USA, March 8-12, 2020},
publisher = {IEEE},
isbn = {978-1-9435-8071-2},
}