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Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level

Cristian Busca, Remus Teodorescu, Frede Blaabjerg, Lars Helle, Tusitha Abeyasekera. Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level. In IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Vienna, Austria, November 10-13, 2013. pages 677-682, IEEE, 2013. [doi]

Authors

Cristian Busca

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Remus Teodorescu

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Frede Blaabjerg

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Lars Helle

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Tusitha Abeyasekera

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