Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level

Cristian Busca, Remus Teodorescu, Frede Blaabjerg, Lars Helle, Tusitha Abeyasekera. Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level. In IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Vienna, Austria, November 10-13, 2013. pages 677-682, IEEE, 2013. [doi]

@inproceedings{BuscaTBHA13,
  title = {Dynamic thermal modelling and analysis of press-pack IGBTs both at component-level and chip-level},
  author = {Cristian Busca and Remus Teodorescu and Frede Blaabjerg and Lars Helle and Tusitha Abeyasekera},
  year = {2013},
  doi = {10.1109/IECON.2013.6699216},
  url = {https://doi.org/10.1109/IECON.2013.6699216},
  researchr = {https://researchr.org/publication/BuscaTBHA13},
  cites = {0},
  citedby = {0},
  pages = {677-682},
  booktitle = {IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, Vienna, Austria, November 10-13, 2013},
  publisher = {IEEE},
}