On testing prebond dies with incomplete clock networks in a 3D IC using DLLs

Michael Buttrick, Sandip Kundu. On testing prebond dies with incomplete clock networks in a 3D IC using DLLs. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 1418-1423, IEEE, 2011. [doi]

Authors

Michael Buttrick

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Sandip Kundu

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