A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method

Junzhe Cai, Changhao Yan, Yudong Tao, Yibo Lin, Sheng-Guo Wang, David Z. Pan, Xuan Zeng 0001. A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method. IEEE Trans. on CAD of Integrated Circuits and Systems, 40(3):603-607, 2021. [doi]

@article{CaiYTLWPZ21,
  title = {A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework With SQP-Based Optimization Method},
  author = {Junzhe Cai and Changhao Yan and Yudong Tao and Yibo Lin and Sheng-Guo Wang and David Z. Pan and Xuan Zeng 0001},
  year = {2021},
  doi = {10.1109/TCAD.2020.3001380},
  url = {https://doi.org/10.1109/TCAD.2020.3001380},
  researchr = {https://researchr.org/publication/CaiYTLWPZ21},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume = {40},
  number = {3},
  pages = {603-607},
}