3D Capacitive Interconnections for High Speed Interchip Communication - researchr publication authors

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Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri. 3D Capacitive Interconnections for High Speed Interchip Communication. In Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, CICC 2007, DoubleTree Hotel, San Jose, California, USA, September 16-19, 2007. pages 1-8, IEEE, 2007. [doi]

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