Electrical measurement of alignment for 3D stacked chips - researchr publication authors

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Roberto Canegallo, Mauro Mirandola, Alberto Fazzi, Luca Magagni, Roberto Guerrieri, Karin Kaschlun. Electrical measurement of alignment for 3D stacked chips. In Laurent Fesquet, Andreas Kaiser, Sorin Cristoloveanu, Michel Brillouët, editors, Proceedings of the 31st European Solid-State Circuits Conference, ESSCIRC 2005, Grenoble, France, 12-16 September 2005. pages 347-350, IEEE, 2005. [doi]

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