Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomas Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps. Electrothermal simulation of bonding wire degradation under uncertain geometries. In Luca Fanucci, Jürgen Teich, editors, 2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016. pages 1297-1302, IEEE, 2016. [doi]
@inproceedings{CasperGGGKMS16,
title = {Electrothermal simulation of bonding wire degradation under uncertain geometries},
author = {Thorben Casper and Herbert De Gersem and Renaud Gillon and Tomas Gotthans and Tomas Kratochvil and Peter Meuris and Sebastian Schöps},
year = {2016},
url = {http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7459510},
researchr = {https://researchr.org/publication/CasperGGGKMS16},
cites = {0},
citedby = {0},
pages = {1297-1302},
booktitle = {2016 Design, Automation & Test in Europe Conference & Exhibition, DATE 2016, Dresden, Germany, March 14-18, 2016},
editor = {Luca Fanucci and Jürgen Teich},
publisher = {IEEE},
isbn = {978-3-9815-3707-9},
}