Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing

Chew Wye Chan, Boon-Ping Gan, Wentong Cai 0001. Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. In Winter Simulation Conference, WSC 2023, San Antonio, TX, USA, December 10-13, 2023. pages 2310-2312, IEEE, 2023. [doi]

Abstract

Abstract is missing.